Akrometrix平面度测量仪AXP 平整度测试加热翘曲测量

Akrometrix平面度测量仪AXP 平整度测试加热翘曲测量

衡鹏供应

比Akrometrix更具自动化的cores平整度测试仪优点
测量*前处理
不需要给测量面涂喷剂或其他前处理,省时省力,避免因前处理产生的数据差异	 
高标准的报告
用3D整面快速连续测量替代点与部分测量,结合温度变化,记录成4D影像,作动静态报告
模拟回流焊
利用与实际回流环境相近的双向热风对流加热方式,同时辐射加热，重现真实的回流环境,
3D + 温度 = 4D	
运用3D技术+温度技术,测量、观察样品加热时的形状变化,并制作成4D
快速获取测量结果
不需要前处理,从加热到输*的全过程都能参数化管理，实时自动化，使测试变得更简单

Akrometrix的thermoiré American Express是一个模块化的计量解决方案，利用阴影莫尔é测量技术，Akrometrix结合自动相位步进，表征出平面位移的样品达400毫米x 400毫米。随着时间的thermoir温度的分析能力，éAXP捕获完整的样本的历史行为的用户定义的热分布在。
é阴影莫尔测量和动态相结合的温度测量是**thermoiré平台的基础。动态分析是较有效的方法来分析由现实世界的过程和操作环境引起的机械行为。使用thermoiréAXP，工程师可以更好地了解材料之间的相互作用，封装，基板和完整的assemblies.axp
的thermoiré AXP是一个可扩展的模块化Akrometrix计量平台：
由软件驱动Akrometrix工作室
高达400毫米×400毫米较大样本大小
在不到2秒的时间内采集140万个位移数据点
提高温度均匀，对流加热和冷却cre6模块
小外形样品样品的高分辨率测量
XYZ轴应变和热膨胀系数的计算，通过DIC
提高实验室生产力与先进的，动力冷却
支持可靠性测试从- 50°C至150°C +和回流焊模拟到280°C +，通过CM
提高吞吐量的多部件测试

Akrometrix的thermoiré AXP可以用于各种实验室和生产车间的应用：
故障/缺陷分析
质量保证/质量控制
高容量测试出部分跟踪技术
通过/失败的决定与行业标准，简化了实时分析软件
通过接口分析软件的连接接口之间的形状匹配
材料与设计选择
局部特征和使用DFP台阶高度的表征
有限元模型的验证
的thermoiréAXP可选模块提供了先进的测量、处理和吞吐能力：
数字图像相关（DIC）2模块
对流回流仿真（cre6）模块
数字条纹投影（DFP）模块
对流模块（厘米）
coolboost模块


Akrometrix平面度测量仪AXP 相关产品
CORES 平面度测量/平整度测试/加热翘曲测量 
core9012a/core9031a/core9032a/core9037a/core9038a/core9045a/core9046a/core9050b/core9055a/core9060a/core9070a/core9100a
Akrometrix平面度测量/平整度测试/加热翘曲测量
AXP-300x233/Convective-Module-Tower/CRE6 Module/CXP/DFP Module/DIC 2.0 Module/Digital Fringe Projection/Digital Image Correlation/Akrometrix Interface Analysis/Akrometrix Part Tracking/PS200S/PS600S/Real Time Analysis/Akrometrix Shadow Moiré/Akrometrix Studio Platform



Thermal Warpage and Strain Measurement Tool

The TherMoiré AXP is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré AXP captures a complete history of a sample’s behavior during a user-defined thermal profile.

The combination of shadow moiré measurement and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré AXP, engineers can gain a better understanding of the interactions between materials, packages, substrates and complete assemblies.AXP

The TherMoiré AXP is an expandable modular metrology platform:

Powered by Akrometrix Studio Software
Up to 400 mm x 400 mm maximum sample size
Acquisition of 1.4 million displacement data points in less than 2 seconds
Enhanced temperature uniformity, convective heating and cooling with CRE6 Module
High resolution measurement of small form factor samples
XYZ axis strain and CTE calculation, via DIC
Increased lab productivity with advanced, powered cooling
Support for reliability testing from -50°C to 150°C+ and reflow simulation to 280°C+, via CM
Multiple part testing for increased throughput
The TherMoiré AXP can be used for a variety of laboratory and production floor applications:

Failure/defect analysis
Quality assurance/quality control
High Volume Testing complimented by Part Tracking technology
Pass/Fail decisions versus industry standards, streamlined by Real Time Analysis software
Shape matching between attaching interfaces via Interface Analysis Software
Material and Design Choices
Characterization of Local Features and Step Height using DFP
FEA Model Validation
The TherMoiré AXP Optional Modules provide advanced measurement, processing and throughput capability:

Digital Image Correlation (DIC) 2.0 Module
Convection Reflow Emulation (CRE6) Module
Digital Fringe Projection (DFP) Module
Convective Module (CM)
CoolBoost Module